Substrate Warpage analysis During Solger Reflow Process

Substrate Warpage analysis During Solger Reflow Process

Organic substrate is a composite panel consists of several materials such as BT core, copper, dielectric, solder resist and plugging material. As different material has different material property, when the organic substrate is exposed to thermal excursion in the manufacturing process, the substr...

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書目詳細資料
主要作者:	Beh, Keh Shin
格式:	Thesis
出版:	2004
主題:	TJ Mechanical engineering and machinery
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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