Ultrasonic non-destructive testing of adhesive bonded aluminum plates

Ultrasonic non-destructive testing of adhesive bonded aluminum plates

Ultrasonic wave technique has been proven to be an effective method for adhesive bond integrity evaluation of isotropic materials. Short ultrasonic pulsed waves with center frequencies ranging from 5- 7 MHz are launched into adhesive bonded aluminum plates to detect internal flaws. Shear wave is gen...

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Main Author: Mhd. Subre, Azim Fikri
Format: Thesis
Language:English
Published: 2017
Subjects:
QC Physics
Online Access:http://eprints.utm.my/id/eprint/77866/1/AzimFikriMhdMFS2017.pdf
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spelling my-utm-ep.778662018-07-23T05:46:00Z Ultrasonic non-destructive testing of adhesive bonded aluminum plates 2017-07 Mhd. Subre, Azim Fikri QC Physics Ultrasonic wave technique has been proven to be an effective method for adhesive bond integrity evaluation of isotropic materials. Short ultrasonic pulsed waves with center frequencies ranging from 5- 7 MHz are launched into adhesive bonded aluminum plates to detect internal flaws. Shear wave is generated by using normal compressional probe attached to a perspex wedge which allows the sample to be scanned easily without requiring of immersion liquid. The ultrasonic wave is generated through the adhesive bonded aluminum to measure non-destructively the adhesive layer of aluminum wafer (aluminum-epoxy-aluminum) and the aluminum plates for detection of simulated defect. The resulted wave patterns of adhesively joint metal plates are studied and analysed. The measurement was carried out to evaluate the quality of bond, in the existence of gas porosity and the existence of foreign material between adhesive plates. The results of this experiment show that the ultrasonic wave generated for different conditions of bonds gives distinctive type which enables to distinguish the traveled wave in different media. 2017-07 Thesis http://eprints.utm.my/id/eprint/77866/ http://eprints.utm.my/id/eprint/77866/1/AzimFikriMhdMFS2017.pdf application/pdf en public http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:105049 masters Universiti Teknologi Malaysia, Faculty of Science Faculty of Science
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
language English
topic QC Physics
spellingShingle QC Physics
Mhd. Subre, Azim Fikri
Ultrasonic non-destructive testing of adhesive bonded aluminum plates
description Ultrasonic wave technique has been proven to be an effective method for adhesive bond integrity evaluation of isotropic materials. Short ultrasonic pulsed waves with center frequencies ranging from 5- 7 MHz are launched into adhesive bonded aluminum plates to detect internal flaws. Shear wave is generated by using normal compressional probe attached to a perspex wedge which allows the sample to be scanned easily without requiring of immersion liquid. The ultrasonic wave is generated through the adhesive bonded aluminum to measure non-destructively the adhesive layer of aluminum wafer (aluminum-epoxy-aluminum) and the aluminum plates for detection of simulated defect. The resulted wave patterns of adhesively joint metal plates are studied and analysed. The measurement was carried out to evaluate the quality of bond, in the existence of gas porosity and the existence of foreign material between adhesive plates. The results of this experiment show that the ultrasonic wave generated for different conditions of bonds gives distinctive type which enables to distinguish the traveled wave in different media.
format Thesis
qualification_level Master's degree
author Mhd. Subre, Azim Fikri
author_facet Mhd. Subre, Azim Fikri
author_sort Mhd. Subre, Azim Fikri
title Ultrasonic non-destructive testing of adhesive bonded aluminum plates
title_short Ultrasonic non-destructive testing of adhesive bonded aluminum plates
title_full Ultrasonic non-destructive testing of adhesive bonded aluminum plates
title_fullStr Ultrasonic non-destructive testing of adhesive bonded aluminum plates
title_full_unstemmed Ultrasonic non-destructive testing of adhesive bonded aluminum plates
title_sort ultrasonic non-destructive testing of adhesive bonded aluminum plates
granting_institution Universiti Teknologi Malaysia, Faculty of Science
granting_department Faculty of Science
publishDate 2017
url http://eprints.utm.my/id/eprint/77866/1/AzimFikriMhdMFS2017.pdf
_version_ 1747817850255441920

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