Heat transfer characterization of air circulation inside a system of stackable electronic devices

The purpose of this study is to investigate the ability of forced circulated air inside a system of stackable electronic devices in transferring heat generated from four identical Intel J1900 10W computer processor unit (CPU). Each CPU was isolated from each other by locating it inside four separate...

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Main Author:	Md. Ali, Muhammad Nasir
Format:	Thesis
Language:	English
Published:	2017
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/78864/1/MuhammadNasirMdMFKM2017.pdf
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id	my-utm-ep.78864
record_format	uketd_dc
spelling	my-utm-ep.788642018-09-17T04:21:29Z Heat transfer characterization of air circulation inside a system of stackable electronic devices 2017-07 Md. Ali, Muhammad Nasir TJ Mechanical engineering and machinery The purpose of this study is to investigate the ability of forced circulated air inside a system of stackable electronic devices in transferring heat generated from four identical Intel J1900 10W computer processor unit (CPU). Each CPU was isolated from each other by locating it inside four separated electronic devices which are stacked on each other and sandwiched between cool air supply chamber at bottom and exhaust chamber at top. Validation of numerical model against a benchmark forced convection problem was performed and compared results are in good agreement. Effect of viscous heating, buoyancy, cooling fan speed and device stacking level were numerically analyzed by commercially available computational fluid dynamics (CFD) software ANSYS Fluent version 16. Navier-Stokes equations were solved in simulation of conjugate heat transfer where conduction occurs from CPUs into heatsink and mini-ITX motherboard and subsequently via forced convection of circulated air into environment. Results show that cooling fan speed of 1.0 m/s for prevention of CPU failure during operation is the minimum allowable speed and selected enclosure material should be able to withstand at least 76 °C of near wall temperature. 2017-07 Thesis http://eprints.utm.my/id/eprint/78864/ http://eprints.utm.my/id/eprint/78864/1/MuhammadNasirMdMFKM2017.pdf application/pdf en public http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:109886 masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Md. Ali, Muhammad Nasir Heat transfer characterization of air circulation inside a system of stackable electronic devices
description	The purpose of this study is to investigate the ability of forced circulated air inside a system of stackable electronic devices in transferring heat generated from four identical Intel J1900 10W computer processor unit (CPU). Each CPU was isolated from each other by locating it inside four separated electronic devices which are stacked on each other and sandwiched between cool air supply chamber at bottom and exhaust chamber at top. Validation of numerical model against a benchmark forced convection problem was performed and compared results are in good agreement. Effect of viscous heating, buoyancy, cooling fan speed and device stacking level were numerically analyzed by commercially available computational fluid dynamics (CFD) software ANSYS Fluent version 16. Navier-Stokes equations were solved in simulation of conjugate heat transfer where conduction occurs from CPUs into heatsink and mini-ITX motherboard and subsequently via forced convection of circulated air into environment. Results show that cooling fan speed of 1.0 m/s for prevention of CPU failure during operation is the minimum allowable speed and selected enclosure material should be able to withstand at least 76 °C of near wall temperature.
format	Thesis
qualification_level	Master's degree
author	Md. Ali, Muhammad Nasir
author_facet	Md. Ali, Muhammad Nasir
author_sort	Md. Ali, Muhammad Nasir
title	Heat transfer characterization of air circulation inside a system of stackable electronic devices
title_short	Heat transfer characterization of air circulation inside a system of stackable electronic devices
title_full	Heat transfer characterization of air circulation inside a system of stackable electronic devices
title_fullStr	Heat transfer characterization of air circulation inside a system of stackable electronic devices
title_full_unstemmed	Heat transfer characterization of air circulation inside a system of stackable electronic devices
title_sort	heat transfer characterization of air circulation inside a system of stackable electronic devices
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2017
url	http://eprints.utm.my/id/eprint/78864/1/MuhammadNasirMdMFKM2017.pdf
_version_	1747818090102521856

Heat transfer characterization of air circulation inside a system of stackable electronic devices

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