Development of low coefficient of thermal expansion composite substrate for electronic packaging using finite element method
Coefficient of thermal expansion (CTE) mismatch between the different material layers in the substrate leads to residual warpage and stresses. Such deformation adds additional mechanical constraints to solder joint attached on the surface of substrate and subsequently leads to solder joint reliabili...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 语言: | English |
| 出版: |
2007
|
| 主题: | |
| 在线阅读: | http://eprints.utm.my/id/eprint/9444/1/PangHooiSanMFKM2007.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|