Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading

The reliability assessments of PCB and PCB related products had been adopted by industries for years. Among the reliability test, mechanical shock damage is one of the most predominant modes of failure when PCB experience deformation that creates excessive strain. For dynamic analysis, it is very ex...

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Main Author:	Lau, Chin Wei
Format:	Thesis
Language:	English
Published:	2006
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/9501/1/LauChinWeiMFKM2006.pdf
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id	my-utm-ep.9501
record_format	uketd_dc
spelling	my-utm-ep.95012018-09-17T03:35:34Z Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading 2006-05 Lau, Chin Wei TJ Mechanical engineering and machinery The reliability assessments of PCB and PCB related products had been adopted by industries for years. Among the reliability test, mechanical shock damage is one of the most predominant modes of failure when PCB experience deformation that creates excessive strain. For dynamic analysis, it is very expensive, time consuming and difficult to conduct drop/shock test to detect the damage mechanisms and identify their behaviors. However, this assessment can be performed through a computer simulation by Finite Element Method (FEM). FEM is one of such techniques to achieve solution within reasonable computational time and cost. This study presents dynamic analysis of PCB and PCB devices by FEM. As a fundamental study, the natural dynamic properties of a bare PCB and workstation chassis are obtained by FEM and verified with impact hammer test. Good agreement of natural frequencies and mode shapes had been shown between FEM and tested results. From the verified dynamic properties, the shock analysis was carried out further for PCB with components. Two different ways had been carried out. First, to model the drop impact behavior, the free-fall of PCB with attached chips was modeled for seven drop orientation. The bouncing motion was captured and the dynamic responses on all chips had been analyzed and had good agreement compared to reported research. The second impact analysis is done by simulate the PCB with chips that fixed on a drop block. To implement the input-G method, a short impulse was impose to the PCB fixture surface. The natural dynamic behavior was obtained for fixed boundary condition followed by detail deflection motion of PCB due to impact. The simulated result shows that the center of PCB experiences greatest impact, which is well verified with recent related research. 2006-05 Thesis http://eprints.utm.my/id/eprint/9501/ http://eprints.utm.my/id/eprint/9501/1/LauChinWeiMFKM2006.pdf application/pdf en public http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:1093 masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Lau, Chin Wei Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
description	The reliability assessments of PCB and PCB related products had been adopted by industries for years. Among the reliability test, mechanical shock damage is one of the most predominant modes of failure when PCB experience deformation that creates excessive strain. For dynamic analysis, it is very expensive, time consuming and difficult to conduct drop/shock test to detect the damage mechanisms and identify their behaviors. However, this assessment can be performed through a computer simulation by Finite Element Method (FEM). FEM is one of such techniques to achieve solution within reasonable computational time and cost. This study presents dynamic analysis of PCB and PCB devices by FEM. As a fundamental study, the natural dynamic properties of a bare PCB and workstation chassis are obtained by FEM and verified with impact hammer test. Good agreement of natural frequencies and mode shapes had been shown between FEM and tested results. From the verified dynamic properties, the shock analysis was carried out further for PCB with components. Two different ways had been carried out. First, to model the drop impact behavior, the free-fall of PCB with attached chips was modeled for seven drop orientation. The bouncing motion was captured and the dynamic responses on all chips had been analyzed and had good agreement compared to reported research. The second impact analysis is done by simulate the PCB with chips that fixed on a drop block. To implement the input-G method, a short impulse was impose to the PCB fixture surface. The natural dynamic behavior was obtained for fixed boundary condition followed by detail deflection motion of PCB due to impact. The simulated result shows that the center of PCB experiences greatest impact, which is well verified with recent related research.
format	Thesis
qualification_level	Master's degree
author	Lau, Chin Wei
author_facet	Lau, Chin Wei
author_sort	Lau, Chin Wei
title	Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
title_short	Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
title_full	Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
title_fullStr	Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
title_full_unstemmed	Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
title_sort	modeling of dynamic behavior of printed circuit board (pcb) subjected to mechanical shock loading
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2006
url	http://eprints.utm.my/id/eprint/9501/1/LauChinWeiMFKM2006.pdf
_version_	1747814741131132928

Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading

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