Performance evaluation of finfet silicide based contact through electrical simulation

Continues scaling of device dimension allows the complex integration of increasing number of transistors in a single chip possible. As the semiconductor industry move according to Moore’s law, the scaling down of field effect transistor (FET) has reached less than 10 nm. The conventional planar FET...

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Main Author: Aini, Muhammad Adli
Format: Thesis
Language:English
Published: 2021
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Online Access:http://eprints.utm.my/id/eprint/96835/1/AdliaAiniMSKE2021.pdf.pdf
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spelling my-utm-ep.968352022-08-23T06:51:30Z Performance evaluation of finfet silicide based contact through electrical simulation 2021 Aini, Muhammad Adli HT101-395 Sociology, Urban Continues scaling of device dimension allows the complex integration of increasing number of transistors in a single chip possible. As the semiconductor industry move according to Moore’s law, the scaling down of field effect transistor (FET) has reached less than 10 nm. The conventional planar FET structure can no longer withstand the short channel effect that become pronounce at ultra-narrow channel length. Therefore, alternative transistor architecture FinFET had been introduced. However, the focus to obtain minimal device leakage from this structure is still on-going due to the thin width of fin that causing an incease in parasitic resistance. In this study, silicidation will be implemented on 10nm FinFET structure and analysed through electrical simulations. The parameters studied in this research are threshold voltage (Vth), off current (Ioff), saturation current (Isat), subthreshold slope (SS) and resistance out (Rout). The silicidation process will involve using following materials which are Silicide, Cobalt Silicide, Nickel Silicide, TiSilicide and Tungsten Silicide. Results from the simulations founds that device power leakage reduced by almost 24% when implemented with Nickle Silicde layer. Futher optimization and simulations will provide insight for engineer in implementing silicidation in short channel devices. 2021 Thesis http://eprints.utm.my/id/eprint/96835/ http://eprints.utm.my/id/eprint/96835/1/AdliaAiniMSKE2021.pdf.pdf application/pdf en public http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:142171 masters Universiti Teknologi Malaysia Faculty of Engineering - School of Electrical Engineering
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
language English
topic HT101-395 Sociology
Urban
spellingShingle HT101-395 Sociology
Urban
Aini, Muhammad Adli
Performance evaluation of finfet silicide based contact through electrical simulation
description Continues scaling of device dimension allows the complex integration of increasing number of transistors in a single chip possible. As the semiconductor industry move according to Moore’s law, the scaling down of field effect transistor (FET) has reached less than 10 nm. The conventional planar FET structure can no longer withstand the short channel effect that become pronounce at ultra-narrow channel length. Therefore, alternative transistor architecture FinFET had been introduced. However, the focus to obtain minimal device leakage from this structure is still on-going due to the thin width of fin that causing an incease in parasitic resistance. In this study, silicidation will be implemented on 10nm FinFET structure and analysed through electrical simulations. The parameters studied in this research are threshold voltage (Vth), off current (Ioff), saturation current (Isat), subthreshold slope (SS) and resistance out (Rout). The silicidation process will involve using following materials which are Silicide, Cobalt Silicide, Nickel Silicide, TiSilicide and Tungsten Silicide. Results from the simulations founds that device power leakage reduced by almost 24% when implemented with Nickle Silicde layer. Futher optimization and simulations will provide insight for engineer in implementing silicidation in short channel devices.
format Thesis
qualification_level Master's degree
author Aini, Muhammad Adli
author_facet Aini, Muhammad Adli
author_sort Aini, Muhammad Adli
title Performance evaluation of finfet silicide based contact through electrical simulation
title_short Performance evaluation of finfet silicide based contact through electrical simulation
title_full Performance evaluation of finfet silicide based contact through electrical simulation
title_fullStr Performance evaluation of finfet silicide based contact through electrical simulation
title_full_unstemmed Performance evaluation of finfet silicide based contact through electrical simulation
title_sort performance evaluation of finfet silicide based contact through electrical simulation
granting_institution Universiti Teknologi Malaysia
granting_department Faculty of Engineering - School of Electrical Engineering
publishDate 2021
url http://eprints.utm.my/id/eprint/96835/1/AdliaAiniMSKE2021.pdf.pdf
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