Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly
In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in...
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| Language: | eng eng eng |
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2024
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| Online Access: | https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf https://etd.uum.edu.my/10989/2/s900375_01.pdf https://etd.uum.edu.my/10989/3/s900375_02.pdf |
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my-uum-etd.109892024-02-20T01:33:34Z Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly 2024 Siti Mariam, Man Zain, Zakiyah Mohd Nawawi, Mohd Kamal Awang Had Salleh Graduate School of Arts & Sciences Awang Had Salleh Graduate School of Arts & Sciences HE Transportation and Communications In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in a make-to-order (MTO) environment. Such a company is Carsem (M) Sdn. Bhd. which had faced the issues of long cycle time resulting in shipment de-commits, and profit loss. The manual planning procedure could not cater to the demands of a quick turnaround for complex products 2024 Thesis https://etd.uum.edu.my/10989/ https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf text eng staffonly https://etd.uum.edu.my/10989/2/s900375_01.pdf text eng staffonly https://etd.uum.edu.my/10989/3/s900375_02.pdf text eng staffonly other doctoral Universiti Utara Malaysia |
| institution |
Universiti Utara Malaysia |
| collection |
UUM ETD |
| language |
eng eng eng |
| advisor |
Zain, Zakiyah Mohd Nawawi, Mohd Kamal |
| topic |
HE Transportation and Communications |
| spellingShingle |
HE Transportation and Communications Siti Mariam, Man Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| description |
In the rapid growth of the semiconductor industry, subcontractors are highly competitive to gain their market segment and sustain the business. The ability to meet the shipment commits is critical, often gated by the process cycle time. Increasing challenges arise with high product customization in a make-to-order (MTO) environment. Such a company is Carsem (M) Sdn. Bhd. which had faced the issues of long cycle time resulting in shipment de-commits, and profit loss. The manual planning procedure could not cater to the demands of a quick turnaround for complex products |
| format |
Thesis |
| qualification_name |
other |
| qualification_level |
Doctorate |
| author |
Siti Mariam, Man |
| author_facet |
Siti Mariam, Man |
| author_sort |
Siti Mariam, Man |
| title |
Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_short |
Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_full |
Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_fullStr |
Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_full_unstemmed |
Development of Wire-Bonding Dispatch System Using Lean Six Sigma for Semiconductor Back-End Assembly |
| title_sort |
development of wire-bonding dispatch system using lean six sigma for semiconductor back-end assembly |
| granting_institution |
Universiti Utara Malaysia |
| granting_department |
Awang Had Salleh Graduate School of Arts & Sciences |
| publishDate |
2024 |
| url |
https://etd.uum.edu.my/10989/1/depositpermission-s900375.pdf https://etd.uum.edu.my/10989/2/s900375_01.pdf https://etd.uum.edu.my/10989/3/s900375_02.pdf |
| _version_ |
1794023804593242112 |