Ghosh, S. K. (2015). Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate.
Chicago Style (17th ed.) CitationGhosh, Sujan Kumer. Effects of Metallic Nanoparticle Doped Flux on Morphology and Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Copper Substrate. 2015.
MLA引文Ghosh, Sujan Kumer. Effects of Metallic Nanoparticle Doped Flux on Morphology and Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Copper Substrate. 2015.
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