Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
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| 主要作者: | |
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| 格式: | Thesis 图书 |
| 语言: | English |
| 出版: |
2015.
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| 实物描述: | xvii, 141 leaves : illustrations ; 30 cm. |
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| 参考书目: | Bibliography: leaves 118-139. |