Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2015.
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| Subjects: | |
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| Physical Description: | xvii, 141 leaves : illustrations ; 30 cm. |
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| Bibliography: | Bibliography: leaves 118-139. |