Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2015.
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| LEADER | 01448cam a2200325 i 4500 | ||
|---|---|---|---|
| 001 | u1018340 | ||
| 003 | SIRSI | ||
| 005 | 201507130916 | ||
| 008 | 150713s2015 my a m 000 0 eng | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TJ7 |b UM 2015 Gho | ||
| 097 | |a TJ7 |b UM 2015 Gho | ||
| 100 | 1 | |a Ghosh, Sujan Kumer, |e author | |
| 245 | 1 | 0 | |a Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate / |c Sujan Kumer Ghosh. |
| 264 | 1 | |c 2015. | |
| 264 | 4 | |c 2015. | |
| 300 | |a xvii, 141 leaves : |b illustrations ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b M.Eng.Sc. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2015. | ||
| 504 | |a Bibliography: leaves 118-139. | ||
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 650 | 0 | |a Solder and soldering. | |
| 710 | 2 | |a Universiti Malaya. |b Fakulti Kejuruteraan, |e degree granting institution. | |
| 900 | |a NSR-AMA | ||
| 596 | |a 1 7 | ||
| 999 | |a TJ7 UM 2015 GHO |w LC |c 1 |i A516366453 |d 20/6/2016 |f 20/6/2016 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 20/6/2016 |1 STEM | ||
| 999 | |a TJ7 UM 2015 GHO |w LC |c 2 |i A516366379 |d 20/6/2016 |f 20/6/2016 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 20/6/2016 |1 STEM | ||
| 999 | |a TJ7 UM 2015 GHO |w LC |c 1 |i A516228678 |d 19/12/2016 |f 19/12/2016 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 19/12/2016 |1 STEM | ||