Jannatun Adzura Adnan. (2015). Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer.
Chicago Style (17th ed.) CitationJannatun Adzura Adnan. Effect of Electromigration on the Lead-free Solder Joint with Addition of Porous Copper Interlayer. 2015.
MLA (8th ed.) CitationJannatun Adzura Adnan. Effect of Electromigration on the Lead-free Solder Joint with Addition of Porous Copper Interlayer. 2015.
Warning: These citations may not always be 100% accurate.