APA引文

Jannatun Adzura Adnan. (2015). Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer.

Chicago Style (17th ed.) Citation

Jannatun Adzura Adnan. Effect of Electromigration on the Lead-free Solder Joint with Addition of Porous Copper Interlayer. 2015.

MLA引文

Jannatun Adzura Adnan. Effect of Electromigration on the Lead-free Solder Joint with Addition of Porous Copper Interlayer. 2015.

警告：这些引文格式不一定是100％准确.