Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /

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Bibliographic Details
Main Author: Jannatun Adzura Adnan (Author)
Format: Thesis Book
Language:English
Published: 2015.
Subjects:
Online Access:http://studentsrepo.um.edu.my/id/eprint/5840
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Description
Physical Description:xi, 77 leaves : illustrations ; 30 cm.
Also issued in CD.
Bibliography:Bibliography: leaves 28-29.