Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2015.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/id/eprint/5840 |
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| Physical Description: | xi, 77 leaves : illustrations ; 30 cm. Also issued in CD. |
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| Bibliography: | Bibliography: leaves 28-29. |