Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2015.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/id/eprint/5840 |
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| LEADER | 01477cam a2200349 i 4500 | ||
|---|---|---|---|
| 001 | u1030144 | ||
| 003 | SIRSI | ||
| 005 | 201507311054 | ||
| 008 | 160322s2015 my a m 000 0 eng | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TJ7 |b UM 2015 Janaa | ||
| 097 | |a TJ7 |b UM 2015 Janaa | ||
| 100 | 0 | |a Jannatun Adzura Adnan, |e author. | |
| 245 | 1 | 0 | |a Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer / |c Jannatun Adzura binti Adnan. |
| 264 | 1 | |c 2015. | |
| 264 | 4 | |c 2015. | |
| 300 | |a xi, 77 leaves : |b illustrations ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b M.Eng. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2015. | ||
| 504 | |a Bibliography: leaves 28-29. | ||
| 530 | |a Also issued in CD. | ||
| 650 | 0 | |a Electrodiffusion. | |
| 650 | 0 | |a Solder and soldering. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/id/eprint/5840 |
| 900 | |a AMA NSR | ||
| 596 | |a 1 7 | ||
| 999 | |a TJ7 UM 2015 JANAA |w LC |c 1 |i A516556395 |d 25/7/2016 |f 25/7/2016 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 25/7/2016 |1 STEM | ||
| 999 | |a TJ7 UM 2015 JANAA |w LC |c 2 |i A516556381 |d 25/7/2016 |f 25/7/2016 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 25/7/2016 |1 STEM | ||
| 999 | |a TJ7 UM 2015 JANAA |w LC |c 1 |i A516232641 |d 9/12/2016 |f 9/12/2016 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 30/11/2016 | ||