APA引文

Nashrah Hani Jamadon. (2017). Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer.

Chicago Style (17th ed.) Citation

Nashrah Hani Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer. 2017.

MLA引文

Nashrah Hani Jamadon. Mechanical and Thermal Aging Behaviors of Lead Free Solder Joint with Addition of Porous Copper Interlayer. 2017.

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