http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer
xxii, 133 leaves : illustrations ; 30 cm.
Ph.D. Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya 2017.