Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer /

Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer /

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书目详细资料
主要作者:	Nashrah Hani Jamadon (Author)
格式:	Thesis 图书
语言:	English
出版:	2017.
主题:	Porous materials > Thermal properties. Solder and soldering.
在线阅读:	http://studentsrepo.um.edu.my/7960/
标签:	添加标签没有标签, 成为第一个标记此记录!

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