Performance evaluation of copper brazing using CU-NI-Sn-P filler metal /

Performance evaluation of copper brazing using CU-NI-Sn-P filler metal /

Saved in:

书目详细资料
主要作者:	Mohd Zubir Md Idris (Author)
格式:	Thesis 图书
语言:	English
出版:	2017.
主题:	Copper > Brazing. Brazing alloys. Filler metal.
在线阅读:	http://studentsrepo.um.edu.my/8494/
标签:	添加标签没有标签, 成为第一个标记此记录!

相似书籍

Investigation of cadmium-free brazing filler metals based on Ag-Cu-In and Ag-Cu-Sn systems /
由: Sisamouth, Lamphanh
出版: (2011)

Brazing of single crystal nickel with Ni-B-Si filler metal /
由: Wu, Haiming
出版: (1996)

Brazing of pure copper with BAg-8 braze alloy /
由: Bagus Budi Dharma, I Gusti
出版: (2005)

Practical aspects of wide-gap brazing /
由: Lee, Wee Yin
出版: (1992)

Brazing sapphire and inconel 600 using active filler metal (Ag-Cu-Ti) for fabrication of gas pressure sensor /
由: Tuan Zaharinie Tuan Zahari
出版: (2014)

A novel method of brazing Cu/Cu-7.0Ni-9.3Sn-6.5P/Cu using microwave hybrid heating /
由: Maisarah Lutfi
出版: (2021)

Microstructure and mechanical properties of porous copper and copper brazed with cu-based filler metal /
由: Sami, Mian Muhammad
出版: (2021)

Microstructural studies of nickel-base brazes /
由: Tung, Siew Kong
出版: (1997)

Fracture and fatigue of stainless steel wide gap brazed with nickel based filler metals /
由: Yu, Yonghe
出版: (1994)

The effect of alumina purity on joint strength of brazing /
由: Vongphosy, Sompong
出版: (2009)

Wide gap brazing with pre-packs /
由: Tung, Siew Kong
出版: (1992)

Investigation on the mechanical properties and the microstructure of brazed tungsten carbide/tool steel joints /
由: El-Abdelsalam, Abdelaziz
出版: (2010)

Design and manufacturing of brazed joint laminated mold with conformal cooling channel for plastic injection molding /
由: Fauzun
出版: (2009)

Mechanical properties of nickel base wide gap brazed joint /
由: Wei, Dake
出版: (1993)

A finite element analysis of residual stress in brazing of sapphire and inconel /
由: Chan, Chow Khuen
出版: (2011)

Brazing of porous copper with copper substrate by using CU-7NI-9.3SN-6.3P as a filler /
由: Fauziah Mohamed Roshidi
出版: (2014)

Mechanical and microstructure analysis of copper to copper foam brazing using copper-tin-nickel-phosphorus amorphous filler alloys /
由: Nur Amirah Mohd Zahri
出版: (2021)

Effect of electrodeposited Cu-Ni layer on interfacial reaction and mechanical properties of laser welded-brazed Mg/Ti joints /
由: Tukur, Auwal Shamsu
出版: (2019)

Development of aluminium-copper die-attach alloy for high operational temperature application /
由: Siah, Meng Zhe
出版: (2019)

Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
由: Mahdavifard, Mohammad Hossein
出版: (2017)

Preparation of biomineral filler and its application as biopolymer composite filler /
由: Nur Damia Mohd Ismail
出版: (2013)

Formation, structure and properties of copper-based alloys by non-equilibrium processing methods /
由: Tan, Lai Kuan
出版: (2000)

The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement

Fabrication of AI-4.5 Cu/10vol%SiC composite via mechanical alloying technique /
由: Kek, Joon Kee
出版: (1999)

Utilization of steel industry slag for removal of copper and manganese
由: Beh, Chin Lai
出版: (2011)

Inhibition of corrosion for different metals in palm biodiesel /
由: Nur Suhaila Rosli
出版: (2019)

The evolution of microstructures and properties due to materials tool interaction during friction stir welding of similar and dissimilar al and Cu alloys

Synthesis of bismuth vanadate and copper-doped bismuth vanadate as visible light photocatalysts
由: Mohd Ali, Norsalinda
出版: (2010)

Synthesis, characterization and performance of visible light active copper-loaded bismuth vanadate photocatalyst
由: Wan, Tze Peng
出版: (2016)

The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
由: Angellia, Lian Dewi
出版: (2009)

Preparation and bioactivities of Cu(II) and Ni(II) complexes containing amino acid-derived schiff bases
由: Abas, Nur Fatihah
出版: (2017)

Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
由: Jaffery, Syed Hassan Abbas
出版: (2017)

Effect of vibration frequencies on the welding properties of rectangular mild steel plate
由: Hussein, Alaa Raad
出版: (2010)

Mechanical, thermal and microstructural properties of the low-Ag-content Sn-1Ag-0.5Cu solder alloy bearing Fe or A1 for electronics applications /
由: Shnawah, Dhafer Abdul-Ameer
出版: (2013)

Mechanical properties of ultra-fine grain aluminium AL6063 and pure copper processed by equal channel angular extrusion method
由: Nemati, Jamshid
出版: (2015)

Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
由: Leong, Yee Mei
出版: (2020)

Pencirian nanoaloi A1-Cu yang disediakan denga kaedah aloian mekanik /
由: Ali Oemar, Marjoni Imamora
出版: (2005)

Development and characterisation of unsaturated polyester composite incorporating waste rubber glove crumbs as fillers
由: Mustafa, Nuzaimah
出版: (2020)

Synthesis and conductivity of copper zinc tin selenide quaternary chalcogenide semiconductor
由: Leong, Yong Jian
出版: (2016)

Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
由: Azida Azmi
出版: (2012)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group