Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /

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Bibliographic Details
Main Author:	Mohd Firdaus Manap (Author)
Format:	Thesis Book
Language:	English
Published:	2017.
Subjects:	Palladium. Copper wire. Wire bonding (Electronic packaging)
Online Access:	http://studentsrepo.um.edu.my/8479/
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001	u1076882
003	SIRSI
005	201803081643
008	180308s2017 my a m 000 0 eng
040			\|a UMM \|d UMJ \|d AUM \|e rda
090			\|a TK7 \|b UM 2017 Mohfm
097			\|a TK7 \|b UM 2017 Mohfm
100	0		\|a Mohd Firdaus Manap, \|e author.
245	1	0	\|a Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire / \|c Mohd Firdaus Bin Manap.
264		1	\|c 2017.
300			\|a vii, 70 leaves, 1 unnumbered leaves : \|b illustrations ; \|c 30 cm.
336			\|a text \|2 rdacontent
337			\|a unmediated \|2 rdamedia
338			\|a volume \|2 rdacarrier
502			\|b M.Eng. \|c Jabatan Kejuruteraan Elektrik, Fakulti Kejuruteraan, Universiti Malaya \|d 2017.
504			\|a Bibliography: leaves 68-70.
650		0	\|a Palladium.
650		0	\|a Copper wire.
650		0	\|a Wire bonding (Electronic packaging)
710	2		\|a Universiti Malaya. \|b Jabatan Kejuruteraan Elektrik, \|e degree granting institution.
856	4	1	\|u http://studentsrepo.um.edu.my/8479/
596			\|a 1 7 25
900			\|a NSM AMA
999			\|a TK7 UM 2017 MOHFM \|w LC \|c 1 \|i A517082373 \|d 23/5/2018 \|f 23/5/2018 \|g 1 \|l STACKS \|m P01UTAMA \|r Y \|s Y \|t TESIS \|u 4/5/2018 \|1 STEM \|o .PUBLIC. \|o .STAFF.
999			\|a TK7 UM 2017 MOHFM \|w LC \|c 1 \|i A517140249 \|f 22/8/2023 \|g 1 \|l STACKS \|m P25UMARCHI \|r N \|s Y \|t CD \|u 11/6/2018 \|1 STEM \|o .PUBLIC. \|o .STAFF. MST-CD9209
999			\|a TK7 UM 2017 MOHFM \|w LC \|c 1 \|i A516961251 \|d 20/7/2018 \|f 20/7/2018 \|g 1 \|l RESTRICTED \|m P07JURUTER \|r Y \|s Y \|t TESIS \|u 20/7/2018 \|1 STEM \|o .PUBLIC. Embargoed until 31.12.2018. \|o .STAFF. Item kept in UMJ-AMA 23.05.2018.

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