Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys /

Effects of Zn and A1 on corrosion characteristics of Sn-1.0Ag-0.5Cu alloys /

Saved in:

書目詳細資料
主要作者:	Nurul Liyana Kamaruzaman (Author)
格式:	Thesis 圖書
語言:	English
出版:	2018.
主題:	Solder and soldering > Corrosion fatigue. Alloys > Corrosion. Lead-free electronics manufacturing processes. Polarization (Electricity)
在線閱讀:	http://studentsrepo.um.edu.my/9156/
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

相似書籍

Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
由: Jaffery, Syed Hassan Abbas
出版: (2017)

Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
由: Muhammad Hafiz, Zan @ Hazizi

Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
由: Mahdavifard, Mohammad Hossein
出版: (2017)

Evaluation of corrosive environment impact on low cost fe/A1 added SAC105 solder alloys /
由: Nor Ilyana Muhd Nordin
出版: (2017)

Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
由: Flora, Somidin

Synthesis And Corrosion Inhibition Studies Of Benzoylthiourea Derivatives On Mild Steel In 1.0 M HCI
由: Siti Najihah binti Md Hashim

Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
由: Krishna, Vidyatharran
出版: (2020)

Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /
由: Mardiana Said
出版: (2022)

Effects of metallic nanoparticle doped flux on morphology and growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and copper substrate /
由: Ghosh, Sujan Kumer
出版: (2015)

Electrodeposition and characterization of SN-BI lead-free soldier alloys /
由: Goh, Ying Xin
出版: (2015)

The effect of copper particle addition into Sn-3.5Ag solder /
由: Aemi Nadia Ahmad Sauffi
出版: (2011)

Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
由: Loh, Hwei Ling
出版: (2019)

Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
由: Leong, Yee Mei
出版: (2020)

Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
由: Ibrahim Ahmad
出版: (2007)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
由: Nahavandi, Mahdi
出版: (2014)

The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
由: Nur'aishah Aminah Mohd Amin
出版: (2015)

Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
由: Najib Saedi, Ibrahim

Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
由: Dharma, I Gusti Bagus Budi

Coconut pulp waste extract (cocos nucifera l.) as corrosion inhibitor for mild steel in 1.0 M acid corrosion
由: Rahim, Norin Hafizah
出版: (2017)

The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement

Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route

Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
由: Chew, Chee Sean
出版: (2011)

Effects of molybdenum nanoparticles on lead-free tin-based solder /
由: Mahmood, Md. Arafat

Influence of inhibitor on corrosion behaviour of Al-Mg alloy /
由: Muhamad Nur Irfan Mohd Adly
出版: (2021)

Surface modification of aluminium alloy 5052 and its corrosion characterization /
由: Abu Hanifah Muhamad Ali
出版: (2018)

Surface modification of aluminium-zinc alloy (AA7075) and its corrosion characteristics /
由: Angel Richard
出版: (2018)

Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)

The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
由: Angellia, Lian Dewi
出版: (2009)

Surface modification of aluminium alloy series 6 (AA6061 T657) and its corrosion characteristics /
由: Tseu, Christopher Zia Chyuan
出版: (2019)

Corrosion behaviour on AA2014/15vol. %A1₂0₃P and AA2009/20vol. %SiCw composite after ageing treatment
由: Zamri, Yusoff

Hot air solder levelling (HASL) process parameters optimization for SN100CL

Corrosion of Mg and Mg Alloys for Medical Applications /
由: Nor Ishida Zainal Abidin
出版: (2012)

Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route

Development of high-temperature lead-free solder for semiconductor chip attachment /
由: Haque, Ashraful
出版: (2011)

Towards the development of corrosion resistant aluminium alloys /
由: Nazatul Liana Sukiman

Corrosion of mild steel by microbial films /
由: Chew, Kean Aun
出版: (1992)

Comparison of corrosion of magnesium and aluminium in palm biodiesel /
由: Chew, King Vee

Corrosion effect of ceiba pentandra blends with commercial diesel on aluminium alloys /
由: Vikneswaran Padasivam
出版: (2017)

Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
由: Tay, See Leng
出版: (2011)

Fatigue crack growth behavior of magnesium alloy AZ61 under corrosive environment /
由: Shaifulazuar Rozali
出版: (2011)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group