Low, P. L. (2020). Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging.
Chicago Style (17th ed.) CitationLow, Pui Leng. Curing Characterization of Pressureless Sintered Die Attach Material as Leadfree Salution in Microelectronics Packaging. 2020.
MLA (8th ed.) CitationLow, Pui Leng. Curing Characterization of Pressureless Sintered Die Attach Material as Leadfree Salution in Microelectronics Packaging. 2020.
Warning: These citations may not always be 100% accurate.