APA引文

Low, P. L. (2020). Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging.

Chicago Style (17th ed.) Citation

Low, Pui Leng. Curing Characterization of Pressureless Sintered Die Attach Material as Leadfree Salution in Microelectronics Packaging. 2020.

MLA引文

Low, Pui Leng. Curing Characterization of Pressureless Sintered Die Attach Material as Leadfree Salution in Microelectronics Packaging. 2020.

警告：这些引文格式不一定是100％准确.