Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /

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Bibliographic Details
Main Author: Low, Pui Leng (Author)
Format: Thesis Book
Language:English
Published: 2020
Subjects:
Online Access:http://studentsrepo.um.edu.my/11482/
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Description
Physical Description:vi, 58 leaves : illustrations ; 30 cm
Also issued in CD.
Bibliography:Bibliography: leaves 56-58.