Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/11482/ |
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| Physical Description: | vi, 58 leaves : illustrations ; 30 cm Also issued in CD. |
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| Bibliography: | Bibliography: leaves 56-58. |