Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/11482/ |
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| LEADER | 01521cam a2200349 i 4500 | ||
|---|---|---|---|
| 001 | u1134010 | ||
| 003 | SIRSI | ||
| 005 | 202006051254 | ||
| 008 | 200605s2020 my a m 000 0 eng | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TA7 |b UM 2020 Low | ||
| 097 | |a TJ7 |b UM 2020 Low | ||
| 100 | 1 | |a Low, Pui Leng, |e author. | |
| 245 | 1 | 0 | |a Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging / |c Low Pui Leng. |
| 264 | 1 | |c 2020 | |
| 300 | |a vi, 58 leaves : |b illustrations ; |c 30 cm | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b M.Eng. |c Jabatan Kejuruteraan Mekanikal, Fakulti Kejuruteraan, Universiti Malaya |d 2020. | ||
| 504 | |a Bibliography: leaves 56-58. | ||
| 530 | |a Also issued in CD. | ||
| 650 | 0 | |a Microelectronic packaging |x Materials. | |
| 650 | 0 | |a Sintering. | |
| 650 | 0 | |a Curing |x Equipment and supplies. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/11482/ |
| 900 | |a NSM | ||
| 596 | |a 1 7 | ||
| 999 | |a TA7 UM 2020 LOW |w LC |c 1 |i A517490267 |f 12/6/2020 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 5/6/2020 |1 STEM |o .STAFF. cd & agreement disimpan di Perpustakaan Kejuruteraan. | ||
| 999 | |a TA7 UM 2020 LOW |w LC |c 1 |i A517445824 |f 30/6/2020 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 30/6/2020 |1 STEM | ||
| 999 | |a TA7 UM 2020 LOW |w LC |c 2 |i A517445841 |f 30/6/2020 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 30/6/2020 |1 STEM | ||