APA引文

Tolentino, E. N. (2020). Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor.

Chicago Style (17th ed.) Citation

Tolentino, Erik Nino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor. 2020.

MLA引文

Tolentino, Erik Nino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor. 2020.