Tolentino, E. N. (2020). Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor.
Chicago Style (17th ed.) CitationTolentino, Erik Nino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor. 2020.
MLA (8th ed.) CitationTolentino, Erik Nino. Comparison of Pressure-assist Silver Sintering to Tin Silver Solder Alloy as Die Attach Material in High Power Semiconductor. 2020.
Warning: These citations may not always be 100% accurate.