Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
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Main Author: | |
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Format: | Thesis Book |
Language: | English |
Published: |
2020.
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Subjects: | |
Online Access: | http://studentsrepo.um.edu.my/12151/ |
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Physical Description: | 50 unnumbered leaves : illustrations ; 30 cm Also issued in CD |
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Bibliography: | Bibliography: leaves [unnumbered leave 48-50] |