Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /

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Bibliographic Details
Main Author: Tolentino, Erik Nino (Author)
Format: Thesis Book
Language:English
Published: 2020.
Subjects:
Online Access:http://studentsrepo.um.edu.my/12151/
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100 1 |a Tolentino, Erik Nino,  |e author. 
245 1 0 |a Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /  |c Erik Nino Tolentino. 
264 1 |c 2020. 
300 |a 50 unnumbered leaves :  |b illustrations ;  |c 30 cm 
336 |a text  |2 rdacontent 
336 |a still image  |2 rdacontent 
337 |a unmediated  |2 rdamedia 
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502 |b M.Eng.  |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya  |d 2020. 
504 |a Bibliography: leaves [unnumbered leave 48-50] 
530 |a Also issued in CD 
650 0 |a Microelectronic packaging. 
650 0 |a Sintering. 
650 0 |a Power electronics. 
650 0 |a Power semiconductors. 
650 0 |a Solder and soldering. 
710 2 |a Universiti Malaya.  |b Jabatan Kejuruteraan Mekanik,  |e degree granting institution. 
856 4 1 |u http://studentsrepo.um.edu.my/12151/ 
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