Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
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Main Author: | |
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Format: | Thesis Book |
Language: | English |
Published: |
2020.
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Subjects: | |
Online Access: | http://studentsrepo.um.edu.my/12151/ |
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LEADER | 01680nam a2200385 i 4500 | ||
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001 | u1139319 | ||
003 | SIRSI | ||
005 | 202011250926 | ||
008 | 201125s2020 my a m 000 0 eng | ||
040 | |a UMM |d UMJ |e rda | ||
090 | |a TA7 |b UM 2020 Tol | ||
097 | |a TA7 |b UM 2020 Tol | ||
100 | 1 | |a Tolentino, Erik Nino, |e author. | |
245 | 1 | 0 | |a Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor / |c Erik Nino Tolentino. |
264 | 1 | |c 2020. | |
300 | |a 50 unnumbered leaves : |b illustrations ; |c 30 cm | ||
336 | |a text |2 rdacontent | ||
336 | |a still image |2 rdacontent | ||
337 | |a unmediated |2 rdamedia | ||
338 | |a volume |2 rdacarrier | ||
502 | |b M.Eng. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2020. | ||
504 | |a Bibliography: leaves [unnumbered leave 48-50] | ||
530 | |a Also issued in CD | ||
650 | 0 | |a Microelectronic packaging. | |
650 | 0 | |a Sintering. | |
650 | 0 | |a Power electronics. | |
650 | 0 | |a Power semiconductors. | |
650 | 0 | |a Solder and soldering. | |
710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
856 | 4 | 1 | |u http://studentsrepo.um.edu.my/12151/ |
900 | |a NNANS NSM | ||
596 | |a 1 7 | ||
999 | |a TA7 UM 2020 TOL |w LC |c 1 |i A516609671 |f 9/12/2020 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 25/11/2020 |1 STEM |o .STAFF. terima tesis dari lib. kejuruteraan, CD & surat agreement disimpan di Perp Kejuruteraan | ||
999 | |a TA7 UM 2020 TOL |w LC |c 1 |i A517443205 |f 4/2/2021 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 4/2/2021 |1 STEM | ||
999 | |a TA7 UM 2020 TOL |w LC |c 2 |i A517443196 |l COUNTER |m P07JURUTER |r Y |s Y |t CD |u 4/2/2021 |1 STEM |