Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /

Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /

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书目详细资料
主要作者:	Tolentino, Erik Nino (Author)
格式:	Thesis 图书
语言:	English
出版:	2020.
主题:	Microelectronic packaging. Sintering. Power electronics. Power semiconductors. Solder and soldering.
在线阅读:	http://studentsrepo.um.edu.my/12151/
标签:	添加标签没有标签, 成为第一个标记此记录!

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