Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
2020.
|
| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/12151/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!