APA引文

Leong, Y. M. (2020). Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn.

Chicago Style (17th ed.) Citation

Leong, Yee Mei. Microstructural Characteristics and Mechanical Properties of Sn-Ag-Cu Solders with Minor Additions of Al and Zn. 2020.

MLA引文

Leong, Yee Mei. Microstructural Characteristics and Mechanical Properties of Sn-Ag-Cu Solders with Minor Additions of Al and Zn. 2020.

警告：這些引文格式不一定是100％准確.