Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /

Saved in:
Bibliographic Details
Main Author: Leong, Yee Mei (Author)
Format: Thesis Book
Language:English
Published: 2020.
Subjects:
Online Access:http://studentsrepo.um.edu.my/12532/
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Physical Description:xvii, 142 leaves : illustrations (some colour) ; 30 cm
Also issued in CD.
Bibliography:Bibliography: leaves 131-141.