Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /

Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /

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Bibliographic Details
Main Author: Leong, Yee Mei (Author)
Format: Thesis Book
Language:English
Published: 2020.
Subjects:
Microstructure.
Solder and soldering.
Aluminum-zinc alloys.
Online Access:http://studentsrepo.um.edu.my/12532/
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245 1 0 |a Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /  |c Leong Yee Mei. 
264 1 |c 2020. 
300 |a xvii, 142 leaves :  |b illustrations (some colour) ;  |c 30 cm 
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650 0 |a Microstructure. 
650 0 |a Solder and soldering. 
650 0 |a Aluminum-zinc alloys. 
710 2 |a Universiti Malaya.  |b Jabatan Kejuruteraan Mekanik,  |e degree granting institution. 
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