Effect of heating on bonding characteristics for copper wire bond technology /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2021.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/14263/ |
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| Physical Description: | xvi, 121 leaves : colour illustrations ; 30 cm Also issued in CD. |
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| Bibliography: | Bibiliography: leaves 103-119. |