Effect of heating on bonding characteristics for copper wire bond technology /

Effect of heating on bonding characteristics for copper wire bond technology /

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書目詳細資料
主要作者:	Gurbinder Singh Gurmukh Singh (Author)
格式:	Thesis 圖書
語言:	English
出版:	2021.
主題:	Copper wire. Electric wire. Copper > Thermal properties. Microelectronics.
在線閱讀:	http://studentsrepo.um.edu.my/14263/
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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