Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /

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Bibliographic Details
Main Author: Wakeel, Saif (Author)
Format: Thesis Book
Language:English
Published: 2021.
Subjects:
Online Access:http://studentsrepo.um.edu.my/13581/
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100 1 |a Wakeel, Saif,  |e author. 
245 1 0 |a Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /  |c Saif Wakeel. 
264 1 |c 2021. 
300 |a xvi, 112 leaves :  |b illustrations (some colour) ;  |c 30 cm 
336 |a text  |2 rdacontent 
336 |a still image  |2 rdacontent 
337 |a unmediated  |2 rdamedia 
338 |a volume  |2 rdacarrier 
502 |b M.Eng.Sc.  |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya  |d 2021. 
504 |a Bibliography: leaves 93-111. 
650 0 |a Electronic packaging  |x Materials. 
650 0 |a Fine pitch technology. 
650 0 |a Solder and soldering. 
650 0 |a Surface mount technology. 
710 2 |a Universiti Malaya.  |b Jabatan Kejuruteraan Mekanik,  |e degree granting institution. 
856 4 1 |u http://studentsrepo.um.edu.my/13581/ 
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