Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
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Main Author: | |
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Format: | Thesis Book |
Language: | English |
Published: |
2021.
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Subjects: | |
Online Access: | http://studentsrepo.um.edu.my/13581/ |
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LEADER | 01478nam a2200349 i 4500 | ||
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001 | u1154953 | ||
003 | SIRSI | ||
005 | 202204081129 | ||
008 | 220408s2021 my a m 000 0 eng | ||
040 | |a UMM |e rda | ||
090 | |a TA7 |b UM 2021 Wak | ||
097 | |a TA7 |b UM 2021 Wak | ||
100 | 1 | |a Wakeel, Saif, |e author. | |
245 | 1 | 0 | |a Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / |c Saif Wakeel. |
264 | 1 | |c 2021. | |
300 | |a xvi, 112 leaves : |b illustrations (some colour) ; |c 30 cm | ||
336 | |a text |2 rdacontent | ||
336 | |a still image |2 rdacontent | ||
337 | |a unmediated |2 rdamedia | ||
338 | |a volume |2 rdacarrier | ||
502 | |b M.Eng.Sc. |c Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya |d 2021. | ||
504 | |a Bibliography: leaves 93-111. | ||
650 | 0 | |a Electronic packaging |x Materials. | |
650 | 0 | |a Fine pitch technology. | |
650 | 0 | |a Solder and soldering. | |
650 | 0 | |a Surface mount technology. | |
710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik, |e degree granting institution. | |
856 | 4 | 1 | |u http://studentsrepo.um.edu.my/13581/ |
900 | |a NNANS US | ||
596 | |a 1 7 | ||
999 | |a TA7 UM 2021 WAK |w LC |c 1 |i A517727555 |f 13/6/2022 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 8/4/2022 |1 STEM |o .STAFF. TERIMA DARI P. KEJURUTERAAN TANPA CD & SURAT AGREEMENT. | ||
999 | |a TA7 UM 2021 WAK |w LC |c 1 |i A517747405 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 26/5/2022 |1 STEM |o .PUBLIC. CD kept in the Engineering library. |