Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /

Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /

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书目详细资料
主要作者:	Wakeel, Saif (Author)
格式:	Thesis 图书
语言:	English
出版:	2021.
主题:	Electronic packaging > Materials. Fine pitch technology. Solder and soldering. Surface mount technology.
在线阅读:	http://studentsrepo.um.edu.my/13581/
标签:	添加标签没有标签, 成为第一个标记此记录!

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