APA引文

Mardiana Said. (2022). Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor.

Chicago Style (17th ed.) Citation

Mardiana Said. Characterization of Sn-3.0Ag-0.5Cu/Cu Solder Joints by Microwave Hybrid Heating with Silicon Wafer Susceptor. 2022.

MLA引文

Mardiana Said. Characterization of Sn-3.0Ag-0.5Cu/Cu Solder Joints by Microwave Hybrid Heating with Silicon Wafer Susceptor. 2022.

警告：这些引文格式不一定是100％准确.