Mardiana Said. (2022). Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor.
Chicago Style (17th ed.) CitationMardiana Said. Characterization of Sn-3.0Ag-0.5Cu/Cu Solder Joints by Microwave Hybrid Heating with Silicon Wafer Susceptor. 2022.
MLA (8th ed.) CitationMardiana Said. Characterization of Sn-3.0Ag-0.5Cu/Cu Solder Joints by Microwave Hybrid Heating with Silicon Wafer Susceptor. 2022.
Warning: These citations may not always be 100% accurate.