Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /

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Bibliographic Details
Main Author: Mardiana Said
Format: Thesis Book
Language:English
Published: 2022.
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Description
Physical Description:xxiii, 175 leaves : colour illustrations ; 30 cm
Bibliography:Bibliography: leaves 161-173.