Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /

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Bibliographic Details
Main Author: Mardiana Said
Format: Thesis Book
Language:English
Published: 2022.
Subjects:
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040 |a UMM  |e rda 
090 |a TA483.3  |b Mars 
100 0 |a Mardiana Said. 
245 1 0 |a Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /  |c Mardiana binti Said. 
264 1 |c 2022. 
270 |g Mardiana Said.  |a Universiti Malaya. Institut Pengurusan dan Perkhidmatan Penyelidikan. 
300 |a xxiii, 175 leaves :  |b colour illustrations ;  |c 30 cm 
336 |a text  |2 rdacontent 
337 |a unmediated  |2 rdamedia 
338 |a volume  |2 rdacarrier 
502 |b Ph.D.  |c Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral, Universiti Sains Malaysia,  |d 2022. 
504 |a Bibliography: leaves 161-173. 
650 0 |a Hypoeutectic alloys. 
650 0 |a Microwave heating. 
650 0 |a Solder and soldering  |x Design and construction. 
710 2 |a Universiti Sains Malaysia.  |b Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral,  |e degree granting institution. 
900 |a FNM US 
596 |a 1 
999 |a TA483.3 MARS  |w LC  |c 1  |i A517057073  |f 25/1/2023  |g 1  |l STACKS  |m P01UTAMA  |r Y  |s Y  |t TESIS  |u 3/11/2022  |1 STEM  |o .STAFF. Tesis staf