Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /

مواد مشابهة

• Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
  بواسطة: Mahdavifard, Mohammad Hossein
  منشور في: (2017)
• Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
  بواسطة: Flora, Somidin
• Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
  بواسطة: Dharma, I Gusti Bagus Budi
• Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
  بواسطة: Krishna, Vidyatharran
  منشور في: (2020)
• Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
  بواسطة: Leong, Yee Mei
  منشور في: (2020)