Cavitation and dynamic grain growth during hot tensile test in copper /
Saved in:
Main Author: | Lu, Peter Hong Hwa |
---|---|
Format: | Thesis Book |
Language: | English |
Published: |
1991.
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Creep cavitation in copper at high temperature /
by: Pak, Hoe Peng
Published: (1994) -
Void interaction during ductile fracture /
by: Tan, Joo Lett
Published: (1992) -
Environmental corrosion of copper and its protection /
by: Feng, Yiqi
Published: (1997) -
Grain boundary energies in copper /
by: Ramli Omar
Published: (1987) -
Formation of copper dots in copper decoration technique /
by: Pung, Swee Yong
Published: (2002)