APA (7th ed.) Citation

Tan, G. L. (1993). Package cracking mechanism in plastic encapsulated integrated circuit devices.

Chicago Style (17th ed.) Citation

Tan, Geok Leong. Package Cracking Mechanism in Plastic Encapsulated Integrated Circuit Devices. 1993.

MLA (8th ed.) Citation

Tan, Geok Leong. Package Cracking Mechanism in Plastic Encapsulated Integrated Circuit Devices. 1993.

Warning: These citations may not always be 100% accurate.