APA引文

Tan, G. L. (1993). Package cracking mechanism in plastic encapsulated integrated circuit devices.

Chicago Style (17th ed.) Citation

Tan, Geok Leong. Package Cracking Mechanism in Plastic Encapsulated Integrated Circuit Devices. 1993.

MLA引文

Tan, Geok Leong. Package Cracking Mechanism in Plastic Encapsulated Integrated Circuit Devices. 1993.

警告：這些引文格式不一定是100％准確.