rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Package cracking mechanism in plastic encapsulated integrated circuit devices
  name:
    name part: Tan, Geok Leong.
    role:
      role term: creator
  type of resource: text
  genre: legal case and case notes
  origin info:
    place:
      place term: si
    date issued: 1993
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: ix, 110 leaves : ill. (some col.) ; 30 cm.
  note: by Tan Geok Leong.
  note: Dissertation (M.Eng.) -- National University of Singapore, 1993.
  note: Bibliography: leaves 81-85.
  subject:
    topic: Microelectronic packaging
  subject:
    topic: Plastics in packaging
    topic: Fracture
  record info:
    record content source: UMM
    record creation date: 940127
    record identifier: u346956