An intelligent walk-through IC package inspection system /

An intelligent walk-through IC package inspection system /

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Bibliographic Details
Main Author: Lim, Seong Liang
Format: Thesis Book
Language:English
Published: 1995.
Subjects:
Integrated circuits > Design and construction > Quality control
Integrated circuits > Design and construction > Data processing.
Computer vision > Industrial applications.
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Description
Physical Description:vi, 88 leaves : ill. ; 30 cm.
Bibliography:Bibliography: leaves 59-60.

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