APA (7th ed.) Citation

Wee, S. K. (1996). Material characterization of soft solder die attaches for power ICs.

Chicago Style (17th ed.) Citation

Wee, Seng Kee. Material Characterization of Soft Solder Die Attaches for Power ICs. 1996.

MLA (8th ed.) Citation

Wee, Seng Kee. Material Characterization of Soft Solder Die Attaches for Power ICs. 1996.

Warning: These citations may not always be 100% accurate.