APA引文

Wee, S. K. (1996). Material characterization of soft solder die attaches for power ICs.

Chicago Style (17th ed.) Citation

Wee, Seng Kee. Material Characterization of Soft Solder Die Attaches for Power ICs. 1996.

MLA引文

Wee, Seng Kee. Material Characterization of Soft Solder Die Attaches for Power ICs. 1996.

警告：这些引文格式不一定是100％准确.