APA (7th ed.) Citation

Wu, J. (1996). A study of wire sweep during transfer molding on plastic IC packaging.

Chicago Style (17th ed.) Citation

Wu, Jianhua. A Study of Wire Sweep During Transfer Molding on Plastic IC Packaging. 1996.

MLA (8th ed.) Citation

Wu, Jianhua. A Study of Wire Sweep During Transfer Molding on Plastic IC Packaging. 1996.

Warning: These citations may not always be 100% accurate.