A study of wire sweep during transfer molding on plastic IC packaging /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
1996.
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| Subjects: | |
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| LEADER | 00804cam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | u412201 | ||
| 003 | SIRSI | ||
| 008 | 970612s1996 si v 00 1 eng m | ||
| 035 | |a ACD-2917 | ||
| 040 | |a UMM | ||
| 090 | |a TK7870.15 |b Wu | ||
| 100 | 1 | 0 | |a Wu, Jianhua. |
| 245 | 1 | 2 | |a A study of wire sweep during transfer molding on plastic IC packaging / |c by Wu Jianhua. |
| 260 | |c 1996. | ||
| 300 | |a xxiv, 203 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Thesis (Ph.D.) -- National University of Singapore, 1996. | ||
| 504 | |a Bibliography: leaves 190-195. | ||
| 650 | 0 | |a Integrated circuits |x Packaging | |
| 650 | 0 | |a Electronic packaging |x Materials | |
| 650 | 0 | |a Microelectronic packaging. | |
| 948 | |a 12/06/1997 |b 25/11/2000 | ||
| 596 | |a 1 | ||
| 999 | |a TK7870.15 WU |w LC |c 1 |i A506941742 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 22/10/1997 | ||