rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    non sort: A
    title: study of wire sweep during transfer molding on plastic IC packaging
  name:
    name part: Wu, Jianhua.
    role:
      role term: creator
  type of resource: text
  genre: legal case and case notes
  origin info:
    place:
      place term: si
    date issued: 1996
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: print
    extent: xxiv, 203 leaves : ill. ; 30 cm.
  note: by Wu Jianhua.
  note: Thesis (Ph.D.) -- National University of Singapore, 1996.
  note: Bibliography: leaves 190-195.
  subject:
    topic: Integrated circuits
    topic: Packaging
  subject:
    topic: Electronic packaging
    topic: Materials
  subject:
    topic: Microelectronic packaging
  record info:
    record content source: UMM
    record creation date: 970612
    record identifier: u412201