APA (7th ed.) Citation

Chow, S. G. (1996). Thermal analysis of IC components undergoing solder reflow.

Chicago Style (17th ed.) Citation

Chow, Seng Guan. Thermal Analysis of IC Components Undergoing Solder Reflow. 1996.

MLA (8th ed.) Citation

Chow, Seng Guan. Thermal Analysis of IC Components Undergoing Solder Reflow. 1996.

Warning: These citations may not always be 100% accurate.